State Seal Company is your AS9100 Certified source for a full range of thermal management products including:
We are a stocking distributor of the Parker Seals Chomerics product line and we have extensive experience offering thermal interface materials from this leading global manufacturer, including thermal rubber sheet rock products. And our focus is always on service, with a staff that has the technical knowledge to assist our customers in finding exactly the right solution for their needs.
The Chomerics line of THERMFLOW® Phase-Change Materials are designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. These interface pads are easy to handle and to apply at room temperature, but soften as components reach operating temperature, thereby filling interfacial gaps and achieving a performance comparable to thermal grease. These phase change materials are formulated for various clamping pressure ranges. Contact State Seal for more information.
The Chomerics family of THERM-A-GAP® thermal interface materials are designed to conduct heat away from discrete components or entire printed circuit boards and divert it into metal frames, covers or spreader plates. These materials work by filling the voids between hot components and heat sinks or metal chassis. The wide range of material properties available in this product line is suited to a great range of applications. Typical applications include in laptops and similar high density, miniaturized electronics, high-speed disk drives, microprocessors and cache chips.
The Chomerics line of T-WING® and C-WING® heat spreaders are an economical solution to cooling IC devices where space is restricted. These thin and flexible heat spreaders come in laminated foil (T-Wing®) or ceramic (C-Wing®) versions. The C-Wing® is especially appropriate for EMI-sensitive contexts.
Also ask us about how we can help with customized inventory management programs, and services such as kitting, sub-assembly and rapid prototyping.